An ultra-high-speed die attach platform purpose-built for panel-level packaging. At 40K UPH it runs roughly three times faster than the best competing system on the market, while holding ±5μm placement accuracy across a 600×600mm panel.
Key Metrics
- 40KUPH
- Throughput
- ±5μm
- Placement Accuracy
- 600×600mm
- Panel Size
- 8"/12"
- Dual Wafer Feed
Product Advantages
Ultra-High Speed — 40K UPH
Roughly 3× the throughput of the best competing platform, which tops out at 13K UPH.
High Precision — ±5μm
Maintains tight placement accuracy across the full 600×600mm panel.
Dual Wafer Feed & Multi-Head
Proprietary architecture combining twin wafer input with a multi-head bonding system.
Flip-Chip & Face-Up
Handles both flip-chip and face-up attach in a single platform.
Multi-Die Simultaneous Attach
Attaches several die types at once — a capability unique to this platform.
Large-Format Panel
Built for the 600×600mm panel formats driving FOPLP adoption.
Specifications
| Machine Performance | |
|---|---|
| UPH | 40K |
| XY Placement Accuracy | ±6μm @ 3sigma |
| Rotation Accuracy | ±0.1° @ 3sigma |
| Material Handling | |
| Die Size | 0.5×0.5 – 20×20 mm |
| Die Thickness | 0.7 – 0.05 mm |
| Panel Table | |
| Panel Size | 600×600 mm |
| Wafer Table | |
| Dual Wafer Table | 8" / 12" |
| Bond Head System | |
| Bonding Force | 80 – 2000 g |
| Dimensions & Weight | |
| Dimensions | 3400×1800×2000 mm (W×D×H) |
| Weight | 4000 kg |
Specifications are subject to change. Contact us for the current datasheet.
Applications
- FOPLP
- Panel-Level Packaging
- AI Chip Packaging
- Fan-Out