A versatile flip-chip bonder reaching 5μm @3σ placement accuracy, designed to drop into an in-line configuration with optional substrate and head heating.
Key Metrics
- 6000UPH
- Throughput
- ±5μm
- Accuracy @3σ
- ±0.05°
- Rotation @3σ
- 5000g
- Max Bond Force
Product Advantages
Up to 5μm @3σ
Rotation accuracy held to ±0.05° @3σ.
In-Line Capable
Integrates directly into an automated production line.
General-Purpose FC Bonder
Handles a wide range of flip-chip applications on one platform.
Substrate & Head Heating
Available as an option for thermo-compression applications.
Equipment Features
Full Yield Control
Whole-flow production control with fast post-bond inspection.
High Automation
Automatic magazine handling, SMEMA and SECS/GEM; bond position auto-compensation from inspection feedback.
Specifications
| Machine Performance | |
|---|---|
| Cycle Time | 600 ms |
| XY Placement Accuracy | ±5μm @ 3sigma |
| Rotation Accuracy | ±0.05° @ 3sigma |
| Material Handling | |
| Die Size | 3×3 – 30×30 mm |
| Die Thickness | 3 – 0.1 mm |
| Wafer Table | |
| Wafer Size | 8" – 12" |
| Max Angle Correction | ±180° |
| Bond Head System | |
| Bonding Force | max 5000 g (programmable) |
| Dimensions & Weight | |
| Dimensions | 2000×1500×1800 mm (L×W×H) |
| Weight | 2200 kg |
Specifications are subject to change. Contact us for the current datasheet.
Applications
- CSP
- QFN
- LGA / BGA
- WLP Fan-Out