The throughput leader of the range at 15,000 UPH, built for conventional epoxy die attach on wafers up to 12 inches with a universal work table for varied lead frames.
Key Metrics
- 15000UPH
- Throughput
- 250ms
- Cycle Time
- ±20μm
- Accuracy @3σ
- 12"
- Max Wafer
Product Advantages
Highest Throughput in Range
UPH 15000 with a 250ms cycle time.
Dual Dispensing System
Highly flexible twin dispensing for varied adhesive requirements.
Precision Bond Head
Linear-drive bond head with voice-coil torque for accurate pressure control.
Universal Work Table
Handles a wide variety of lead frame types without changeover tooling.
Auto Die Search & Correction
High-precision die search platform with automatic angle correction and motorised wafer expansion.
Vacuum Miss-Pick Detection
Detects missed die by vacuum sensing and re-picks automatically.
Specifications
| Machine Performance | |
|---|---|
| UPH | 15000 |
| Cycle Time | 250 ms |
| XY Placement Accuracy | ±20μm @ 3sigma |
| Rotation Accuracy | ±0.2° @ 3sigma |
| Material Handling | |
| Die Size | 0.4 – 18 mm |
| Die Thickness | 0.7 – 0.1 mm |
| Wafer Table | |
| Wafer Size | max 12" |
| Max Angle Correction | ±180° |
| Bond Head System | |
| Bonding Force | 30 – 3000 g (programmable) |
| Dimensions & Weight | |
| Dimensions | 2100×1450×1800 mm (L×W×H) |
| Weight | 1900 kg |
Specifications are subject to change. Contact us for the current datasheet.
Applications
- QFP
- QFN
- TTSOP
- DIP