DaheSemi

Chip Sorter

Fully automatic chip sorter

Rushes A12

Rushes A12

Rushes A12

Fully automatic chip sorter

A fully automatic sorter for wafers up to 12 inches, with a three-zone output enabling 3-bin classification and fast tray exchange to minimise changeover delay.

Key Metrics

500ms
Cycle Time
3Bin
Output Zones
35mm
Max Die Size
±50μm
Placement Accuracy

Product Advantages

Up to 12" Wafers

Handles wafers of 12 inches and below.

3-Bin Classification

Three output zones allow sorting into three bins in a single pass.

Fast Load / Unload

Rapid feed system minimises delay from tray changeover.

Quick Size Changeover

Switch input and output zone sizes between 2, 3 and 4 inch trays quickly.

Specifications

Machine Performance
Cycle Time500 ms
XY Placement Accuracy±50μm
Rotation Accuracy±1°
Material Handling
Die Size3 – 35 mm
Die Thickness0.7 – 0.1 mm
Magazine / Tray Size2 / 3 / 4 inch tray
Dimensions & Weight
Dimensions1450×1450×1800 mm (L×W×H)
Weight1600 kg

Specifications are subject to change. Contact us for the current datasheet.

Applications

  • Die Sorting
  • Known-Good-Die
  • Wafer Level Test
Rushes S12

Rushes S12

Rushes S12

Semi-automatic chip sorter

A flexible semi-automatic sorter running at 6K UPH, with configurable wafer and material stages that accept a wide range of ring frames and waffle trays.

Key Metrics

6KUPH
Throughput
600ms
Cycle Time
±50μm
Placement Accuracy
1200kg
Weight

Product Advantages

Flexible Wafer Stage

Accepts 12–8 inch wafer ring frames and 10–6 inch mother/daughter rings.

Flexible Material Stage

Accepts 12–8 inch blue-tape ring frames and 2 / 3 / 4 inch waffle trays.

Compact & Light

Smallest footprint in the sorter range at 1200 kg.

Specifications

Machine Performance
UPH6K
Cycle Time600 ms
XY Placement Accuracy±50μm
Rotation Accuracy±1°
Material Handling
Die Size3 – 35 mm
Die Thickness0.7 – 0.8 mm
Magazine / Tray Size2/3/4 inch tray, 12–8 inch ring frame
Dimensions & Weight
Dimensions1450×1100×1700 mm (L×W×H)
Weight1200 kg

Specifications are subject to change. Contact us for the current datasheet.

Applications

  • Die Sorting
  • R&D / Small Batch
  • Wafer Level Test

Tell us about your line, your die and your yield targets.

Request a Demo