D-MARS PLUS
D-MARS PLUS
2nd-generation DAF die bonder for DRAM memory
A compact second-generation DAF thermo-compression die bonder built as a drop-in alternative to Japanese FASFORD equipment. Its reduced footprint improves cleanroom utilisation without giving up throughput.
Key Metrics
- 3500UPH
- Throughput
- ±10μm
- Accuracy @3σ
- 500ms
- Cycle Time
- 12"
- Max Wafer
Product Advantages
High Precision ±10μm @3σ
Angle accuracy held to ±0.1° @3σ.
Dual DAF + Epoxy Dispensing
Independent dispensing control gives finer command of adhesive volume.
Compact Footprint
Smaller floor area and better cleanroom adaptability than comparable platforms.
Fixture Compatible
Accepts most tooling from the F-company DB830 series; similar dimensions mean no extra floor-space cost.
Equipment Features
Throughput
UPH 3000.
High Automation
Fully automatic magazine in/out handling; SMEMA and SECS/GEM supported. Bond position auto-compensates for temperature drift and post-bond inspection results.
Vision System
1920×2560 resolution, 256 grey levels, ±0.1° angular error. Automatic inspection of adhesive volume, shape, position and post-bond condition.
Force Control
Voice-coil torque loop plus encoder for stable bond pressure, programmable 20–3000 g. EPOXY IQC and POST IQC graphical display.
Specifications
| Machine Performance | |
|---|---|
| Cycle Time | 500 ms |
| XY Placement Accuracy | ±10μm @ 3sigma |
| Rotation Accuracy | ±0.1° @ 3sigma |
| Material Handling | |
| Die Size | 0.9×0.9 – 25×25 mm |
| Die Thickness | 0.7 – 0.04 mm |
| Wafer Table | |
| Wafer Size | max 12" |
| Max Angle Correction | ±180° |
| Bond Head System | |
| Bonding Force | 50 – 7000 g (programmable) |
| Dimensions & Weight | |
| Dimensions | 2160×1400×1650 mm (L×W×H) |
| Weight | 2100 kg |
Specifications are subject to change. Contact us for the current datasheet.
Applications
- DFN
- LGA / BGA
- TTSOP
- SOT
