D-MARS 9700Content coming soon.
In DevelopmentA dual-head TC bonder benchmarked directly against the HANMI TC Bonder 4, developed as a domestic alternative for HBM stacking lines. Thermo-compression and hybrid bonding are the critical bottleneck in CoWoS and HBM TSV process flows — and today there is no domestic supplier of HBM TCB equipment in China.
Development progress60%
Key Metrics
- 2
- Bond Heads
- 60%
- Development Progress
- HBM
- Target Process
- 20+yrs
- TCB Experience
Product Advantages
Dual-Head Architecture
Two independent bond heads for higher stacking throughput on HBM lines.
Benchmarked to HANMI TC Bonder 4
Specified feature-for-feature against the current industry reference platform.
Supply-Chain Security
A domestic path for lines currently dependent on Korean equipment.
CoWoS & TSV Ready
Designed for the thermo-compression step in CoWoS and HBM TSV process flows.
Applications
- HBM Stacking
- CoWoS
- TSV
- Hybrid Bonding
- 2.5D / 3D Packaging